Independent reporting and analysis across technology, science, startups and invention.
Waymo will begin mapping and validation drives in the Madrid region with trained specialists behind the wheel before attempting fully autonomous passenger service in 2027. The plan is a significant European test, but the company has not disclosed its launch date, fleet size, service area or fares.
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A color-code experiment on the 98-qubit trapped-ion machine reached 99.9995% logical fidelity, but the result measures protected memory—not yet a useful, universal fault-tolerant computation.
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The Jim Keller-led chip company will use its new Series E to expand Galaxy server production, commercial reach and licensable RISC-V processor technology as customers look for more control over AI infrastructure.
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The Paris Local Division upheld Align Technology’s ridge-based clear-aligner patent and ordered a targeted injunction, recall and destruction across 17 UPC states, while sparing products already delivered for ongoing treatment.
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The Claude maker says 5% of its shares will seed a flexible public-benefit vehicle, with the board able to add more as Anthropic’s value rises — a potentially large commitment whose governance is still unfinished.
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A newly published Subaru application describes a hollow camshaft whose internal balance weight locks at lower speeds and spins freely above a threshold, aiming to suppress imbalance without pulling valve-train resonance into normal engine operation.
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The Bank is urging emerging economies to adapt task-specific AI for local languages, weak connectivity and basic devices — while warning that electricity, skills, institutions and evidence will decide whether the promise reaches people.
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Apple has revised its App Review Guidelines to require user-generated-content and AI creation apps to prevent and remove nonconsensual intimate imagery. A separate rule targets apps that hide harmful features during review and activate them after approval.
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A cluster of ASML patent applications describes equipment for aligning, shaping and bonding semiconductor wafers. The documents reveal a serious technical direction, but ASML has not confirmed a commercial bonder.
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